Smart Soldering
Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.
Optimized Module Size
M10 wafer and 54 cell design, fully considering the size and weight of modules in distributed applications
Smart Module Packaging and Logistics
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.
Optimized Electrical Parameters
The working current is about 13A, which is perfectly adapted to mainstream string inverters.
Gallium-doped Technology
Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.